THE K11™ PPSU

Nozzle Temperature: 380–420°C

Bed Temperature: 150–240°C

Chamber Temperature: 90–230°C

Bed Modification: High temperature glue

Active Cooling Fan: OFF

Layer Height: 0.2 mm

Shell Thickness: ≥ 0.8 mm

Print Speed: 30–60 mm/s

Note: Settings are based on a 0.4mm nozzle.

200°C+ Heat Deflection Resistance: Superior thermal tolerance maintaining dynamic structural integrity under continuous thermal stress exceeding 200°C.

Exceptional Toughness & Impact Resistance: High impact strength and elongation at break, providing excellent crack resistance under repeated mechanical shock.

UL94 V-0 Flame Retardancy: Inherent self-extinguishing behavior meeting UL94 V-0 safety criteria with minimal smoke emissions.

Steam & UV Sterilization Resistance: Outstanding resistance to repeated steam autoclaving, gamma radiation, and UV exposure without material degradation.

Outstanding Aging & Chemical Resistance: Highly resistant to environmental stress cracking, hydrolysis, acids, bases, and common industrial fluids over extended lifetimes.

BPA-Free & Food Exposure Grade: Formulated without bisphenol A, meeting strict requirements for food-contact items and medical component applications.

Stable Mechanical & Electrical Performance: Retains dielectric strength, low loss tangents, and core mechanical metrics across a broad operating temperature range.

Melt Temperature: ~330°C (ISO 11357)

Melt Flow Rate (MFR): 30–35 g/10min¹ (ISO 1133)

Heat Deflection Temperature (HDT): 208°C² (ISO 75)

Vicat Softening Temperature (VST): 220°C³ (ISO 306)

Density: 1.29 g/cm³ (ISO 1183)

Odor: Odorless

Solubility: Insoluble in water

Note: ¹ Test conditions: T= 365℃; m= 5kg. ² Test conditions: 0.45MPa; 120℃/h. ³ Test conditions: 10N; 120℃/h.