THE K6™ BAS 70
Color
White
Weight
Diameter
This advanced water-soluble support is engineered for fast dissolution. It provides stable support and has excellent adhesion to filaments like PLA and PETG.
Suggested Printing Parameters
| Nozzle temperature | 210 ~ 240℃ |
| Bed temperature | 30 ~ 60℃ |
| Bed modification | PEI frosted board |
| Active cooling fan | ON,50~100% |
| Layer height | 0.2mm |
| Shell thickness | ≥ 0.8mm |
| Print speed | 40~150mm/s |
Technical Data Sheet (TDS)
| Material Properties | Typical Value | Test Method |
|---|---|---|
| Melt flow rate (MFR)¹ | 20~30g/10min | ISO 1133 |
| Heat deflection temperature (HDT)² | 52℃ | ISO 75 |
| Vicat softening temperature (VST)³ | 68℃ | ISO 306 |
| Density | 1.21~1.25g/cm³ | ISO 1183 |
| Odor | Odorless | / |
| Solubility | Insoluble in water | / |